Honor X60

Honor X60 Mobile Specifications – Full Details

Key Features of Honor X60

  • Octa-core (2×2.5 GHz Cortex-A78 & 6×2.0 GHz Cortex-A55) — Mediatek Dimensity 7025
  • 6.8 inches, 111.3 cm2 (~88.4% screen-to-body ratio)
  • 8/12 GB LPDDR4X RAM | 256GB/512GB ROM ( Non Expandable)

 

Honor X60 Specifications

Network Technology GSM / CDMA / HSPA / CDMA2000 / LTE / 5G
Launch Announced 2024, October 16
Status Coming soon. Exp. release 2024, October 25
Body Dimensions 166 x 75.8 x 7.9 mm (6.54 x 2.98 x 0.31 in)
Weight 189 g (6.67 oz)
SIM Dual SIM (Nano-SIM, dual stand-by)
Waterproof
Display Type TFT LCD, 120Hz, 850 (HBM)
Size 6.8 inches, 111.3 cm2 (~88.4% screen-to-body ratio)
Resolution 1080 x 2412 pixels, 20:9 ratio (~389 ppi density)
Platform OS Android 14, Magic OS 8
Chipset Mediatek Dimensity 7025 Ultra (6 nm)
CPU Octa-core (2×2.5 GHz Cortex-A78 & 6×2.0 GHz Cortex-A55)
GPU IMG BXM-8-256
Memory Card slot No
Internal 128GB 8GB RAM, 256GB 8GB RAM, 256GB 12GB RAM, 512GB 12GB RAM
Main Camera Single 108 MP, f/1.8, (wide), 1/1.67″, PDAF
Features LED flash, panorama, HDR
Video 1080p@30fps
Selfie camera Single 8 MP, f/2.0, (wide)
Video 1080p@30fps
Sound Loudspeaker Yes
3.5mm jack No
Comms WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band, Wi-Fi Direct
Bluetooth 5.3, A2DP, LE, aptX HD
Positioning GPS, GLONASS, GALILEO, BDS
NFC No
Radio No
USB USB Type-C 2.0, OTG
Features Sensors Fingerprint (side-mounted, optical), accelerometer, gyro, proximity (ultrasound), compass
Battery Type Li-Po 5800 mAh, non-removable
Charging 35W wired
5W reverse wired
Misc Colors Black, Green, Silver
Models BRC-AN00
Price About 160 EUR

Status : Exp. release 2024, October 25


* Specifications of this mobile is collected from different sources on internet. And Possible when mobile will officially announced have different specifications or changed.

May be you like ?

Honor Pad GT Pro

Honor Pad GT Pro Mobile Specifications – Full Details

Honor X60 Pro

Honor X60 Pro Mobile Specifications – Full Details

Leave a Reply

Your email address will not be published. Required fields are marked *